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Certified processes, advanced testing methods, and strict compliance to ensure reliable, production-ready results.
OSI Electronics offers turnkey solutions for the full range of assembly complexity. We partner with Customers on Product Development, New Product Introduction, Mass Production, Sustaining Engineering and Product Lifecycle Management. Our cutting edge technology, manufacturing proficiency and responsive technical services deliver the Tier One capabilities Customers require.
Global sourcing, vendor management, and logistics solutions that reduce risk and keep your projects moving.
Certified processes, advanced testing methods, and strict compliance to ensure reliable, production-ready results.
OSI Electronics offers turnkey solutions for the full range of assembly complexity. We partner with Customers on Product Development, New Product Introduction, Mass Production, Sustaining Engineering and Product Lifecycle Management. Our cutting edge technology, manufacturing proficiency and responsive technical services deliver the Tier One capabilities Customers require.
Global sourcing, vendor management, and logistics solutions that reduce risk and keep your projects moving.
Flexible solutions including quick-turn PCB assembly, turnkey production, and consignment builds.
Certified processes, advanced testing methods, and strict compliance to ensure reliable, production-ready results.
Global sourcing, vendor management, and logistics solutions that reduce risk and keep your projects moving.
Prototype to production PCB design, from simple boards to complex multi-layer layouts
DFM-first approach to reduce respins, control cost, and improve yield
All technologies: single/double-sided, multi-layer, rigid, flex, and rigid-flex
Critical routing expertise for analog, digital, and mixed-signal designs
Analysis-driven optimization: signal integrity and thermal review (high-speed/RF capable)
Manufacturing-ready handoff: BOM + footprint review, alternate risk checks, and full fab/assembly outputs (Gerbers/ODB++, PnP, drawings)
Custom lithium battery packs (Li-ion / LiPo / LiFePO4) for real-world products
Use cases: medical devices, robotics, e-bikes, and power tools
Built to your specs: voltage, capacity, size/form factor, and protection requirements
BMS included: selection, integration, balancing strategy, and safety protections
Design for manufacturability: enclosure/mechanical constraints, thermal considerations, and wiring layout
Prototype → production + compliance: documentation, test plans, and certificate support (UN 38.3 / IEC 62133 / UL 2054 / MSDS)
Costed BOM & quoting: line-item pricing, lead times, MOQs, and availability so you can make fast decisions
BOM scrub + data cleanup: validate part numbers/packaging/AML details so what’s on the BOM can actually be sourced and built
Lifecycle & shortage risk checks: flag NRND/EOL parts early and plan replacements before they become blockers
Alternates & second-sourcing: recommend vetted substitutes to reduce cost and lead time without breaking form/fit/function
Authenticity + traceability (on request): prioritize authorized sources when possible, with inspection/testing options and CoC/traceability documentation
Kitting + logistics coordination: consolidate parts into build-ready kits and align delivery to your PCB/battery build schedule
TCLAD’s Insulated Metal Substrate (IMS®) solutions are purpose-built to meet the most demanding thermal challenges
Thermal Clad dielectric film is easy to laminate, simplifying the fabrication of advanced multi-layer circuit boards.
TCLAD offers the industry’s most extensive range of dielectric materials, providing unmatched design flexibility across a variety of PCB formats
TCLAD immersion cooling fluids are high-performance liquid dielectrics engineered for efficient thermal management of densely packed, high-heat generating electronic systems. These fluids do not conduct electricity and are non-corrosive, allowing safe submersion of electronic equipment and direct heat transfer at the source.
TCLAD’s surface-mountable thermal bridge (SMTB) technology greatly improves heat spreading capacity across printed circuit boards (PCBs), reducing hotspots and enhancing overall thermal dissipation efficiency.
High-quality surface mount and through-hole assembly